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Heat-, heat-sound-insulated cardboards on the basis of glass staple fibers from rocks
Technical Specifications ÒÓ Ó 88 023.018-95 (Without restriction of validity).
Heat-, heat-sound-insulated cardboards are intended for thermal and sound isolation in
plants, home appliances, and also as the closed isolation in multilayered designs of
various branches of a national economy. A basis for manufacture of cardboards are basalt
ultra-, superthin and thin staple fibers.
As binding for manufacture heat-insulated (HC) and heat- sound-proof (HSC) cardboards it
is used bentonitic clay or polyvinylacetate dispersion. Cardboards are issued unhydrophobization
and hydrophobization (index H).
Characteristics of cardboards
Table
The name of parameters | Marks |
HC-1 | HSC-2 | HSCH-2 | HC-4 | HCH-4 | HSC-6 | ÀÒÌ-12 |
Density, kg/m3 | 250-280 | 280-300 | 280-300 | 90-100 | 140-150 | 100-120 | 100-100 |
Heat conductivity, W/m•Ê, at 25 °Ñ | 0,045-0,046 | 0,050-0,052 | 0,050-0,052 | 0,040-0,041 | 0,040-0,41 | 0,040-0,040 | 0,040-0,041 |
Sorption humidifying, %, no more | 4,0 | 4,0 | 4,0 | 2,0 | 2,0 | 3,0 | 0,2 |
Mass fraction of a moisture, %,no more | 2,0 | 2,0 | 2,0 | 1,5 | 1,5 | 2,0 | 1,5 |
Water absorption, %, no more | - | - | 30-30 | - | 30-30 | - | - |
Mass fraction of organic substances, %, no more | - | - | - | 4 | 4 | - | - |
The dynamic module of elasticity, MPa, no more | - | 0,5 | - | - | 0,4 | - | - |
Strength at a stretching, ÌPà, not less | 0,32-0,30 | 0,20-0,15 | 0,20-0,15 | 0,07-0,05 | 0,07-0,05 | - | 0,07-0,05 |
Condensability, %, no more | - | - | - | 6,0-30 | 4,0-3,0 | 3,0-2,0 | 3,0-2,5 |
Thickness, mm | 2-10 | 5-12 | 5-12 | 6-10 | 3 | 5-12 | 4-10 |
Elasticity, %, not less | - | - | - | 90-85 | 90-85 | 90-85 | 90-85 |
Heat conductivity, W/m•Ê, no more, at 125 °Ñ at 300 °Ñ | 0,061-0,063 0,085-0,090 | 0,070-0,072 0,100-0,104 | 0,070-0,072 0,100-0,104 | 0,058-0,059 0,080-0,083 | 0,058-0,059 0,080-0,083 | 0,058-0,059 0,080-0,082 | 0,059-0,061 0,083-0,084 |
Cardboards on clay ñâÿçóþùåì concern to a category not burned down, temperature
of application + 700 °Ñ at bilaterial heating and thermal protection surfaces up to + 1000 °Ñ,
on polyvinyl dispersed ýìóëüñèè - a category difficultly burned down, temperature of
application + 500 °Ñ. In waterproofing cardboards at temperature + 500 °Ñ occurs
destruction waterproofing liquids, however thus the material keeps the heat-sound-proof properties.
Manufacture without waste as waste of cardboards are a subject to repeated processing.
Cardboards of marks HC-4, HCH-4, HSCÊ-6, ÀÒÌ-12 - flexible.
Materials which are used for manufacturing cardboards, do not give in thermochemical
destruction and harmful substances under action of physical factors are not allocated.
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